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 ZXMP3A13F
30V P-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY V(BR)DSS = -30V; RDS(ON) = 0.21
ID = -1.6A
DESCRIPTION
This new generation of trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.
FEATURES
* Low on-resistance * Fast switching speed * Low threshold * Low gate drive * SOT23 package
SOT23
APPLICATIONS
* DC - DC converters * Power management functions * Disconnect switches * Motor control
ORDERING INFORMATION
DEVICE ZXMP3A13FTA ZXMP3A13FTC REEL SIZE 7" 13" TAPE WIDTH 8mm 8mm QUANTITY PER REEL 3000 units 10000 units
PINOUT
DEVICE MARKING
* 313
Top View
PROVISIONAL ISSUE C - JULY 2004 1
ZXMP3A13F
ABSOLUTE MAXIMUM RATINGS
PARAMETER Drain-Source Voltage Gate Source Voltage Continuous Drain Current V GS =10V; T A =25C (b) V GS =10V; T A =70C (b) V GS =10V; T A =25C (a) Pulsed Drain Current (c) Continuous Source Current (Body Diode) (b) Pulsed Source Current (Body Diode) (c) Power Dissipation at T A =25C (a) Linear Derating Factor Power Dissipation at T A =25C (b) Linear Derating Factor Operating and Storage Temperature Range SYMBOL V DSS V GS ID LIMIT -30 20 -1.6 -1.3 -1.4 -6 -1.2 -6 625 5 806 6.4 -55 to +150 UNIT V V A
I DM IS I SM PD PD T j :T stg
A A A mW mW/C mW mW/C C
THERMAL RESISTANCE
PARAMETER Junction to Ambient (a) Junction to Ambient (b) SYMBOL R JA R JA VALUE 200 155 UNIT C/W C/W
NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t 5 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
PROVISIONAL ISSUE C - JULY 2004 2
ZXMP3A13F
CHARACTERISTICS
Max Power Dissipation (W)
10
0.7
RDS(on) Limited
-ID Drain Current (A)
0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 20 40 60 80 100 120 140 160
1
DC 1s 100ms 10ms 1ms 100s
100m
10m Single Pulse Tamb=25C 100m 1
10
-VDS Drain-Source Voltage (V)
Temperature (C)
Safe Operating Area
Derating Curve
Single Pulse Tamb=25C
Thermal Resistance (C/W)
200 150
MaximumPower (W)
1k
Tamb=25C
10
D=0.5
100
Single Pulse
50
D=0.2 D=0.05 D=0.1
1 100 1m 10m 100m 1 10 100 1k
0 100 1m
10m 100m
1
10
100
Pulse Width (s)
Pulse Width (s)
Transient Thermal Impedance
Pulse Power Dissipation
PROVISIONAL ISSUE C - JULY 2004 3
ZXMP3A13F
ELECTRICAL CHARACTERISTICS (at TA = 25C unless otherwise stated)
PARAMETER STATIC Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Gate-Source Threshold Voltage V (BR)DSS I DSS I GSS V GS(th) -1.0 0.210 0.330 2.48 S -30 -0.5 100 V A nA V I D =-250 A, V GS =0V V DS =-30V, V GS =0V V GS = 20V, V DS =0V I =-250 A, V DS = V GS
D
SYMBOL
MIN.
TYP.
MAX. UNIT CONDITIONS
Static Drain-Source On-State Resistance (1) R DS(on) Forward Transconductance (1)(3) DYNAMIC (3) Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING(2) (3) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge Total Gate Charge Gate-Source Charge Gate-Drain Charge SOURCE-DRAIN DIODE Diode Forward Voltage (1) Reverse Recovery Time (3) Reverse Recovery Charge (3) V SD t rr Q rr -0.85 18.6 14.8 t d(on) tr t d(off) tf Qg Qg Q gs Q gd 1.5 2.8 11.3 7.5 2.58 5.15 0.65 0.92 C iss C oss C rss 204 39.8 25.8 g fs
V GS =-10V, I D =-1.4A V GS =-4.5V, I D =-1.1A V DS =-15V,I D =-1.4A
pF pF pF V DS =-15V, V GS =0V, f=1MHz
ns ns ns ns nC nC nC nC V DS =-15V,V GS =-10V, I D =-1.4A V DS =-15V,V GS =-5V, I D =-1.4A V DD =-15V, I D =-1A R G =6.0 , V GS =-10V
-0.95
V ns nC
T J =25C, I S =-1.1A, V GS =0V T J =25C, I F =-0.95A, di/dt= 100A/s
NOTES: (1) Measured under pulsed conditions. Width=300s. Duty cycle 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.
PROVISIONAL ISSUE C - JULY 2004 4
ZXMP3A13F
TYPICAL CHARACTERISTICS
10
T = 25C
10V
-ID Drain Current (A)
-ID Drain Current (A)
5V
1
4V 3.5V 3V 2.5V -VGS 2V
10
T = 150C
10V
5V
4V 3.5V 3V 2.5V 2V
1
0.1
0.1
-VGS 1.5V
0.01 0.1
0.01 0.1
-VDS Drain-Source Voltage (V)
1
10
-VDS Drain-Source Voltage (V)
1
10
Output Characteristics
1.6
Output Characteristics
Normalised RDS(on) and VGS(th)
-ID Drain Current (A)
1.4 1.2 1.0
VGS = -10V ID = -1.4A RDS(on)
T = 150C
1
T = 25C
VGS(th)
0.1 1 2 3
0.8 0.6 -50 0
-VDS = 10V
VGS = VDS ID = -250uA
4
5
50
100
150
-VGS Gate-Source Voltage (V)
Tj Junction Temperature (C)
Typical Transfer Characteristics
RDS(on) Drain-Source On-Resistance ()
100
2V -VGS 2.5V 3V 3.5V 4V T = 25C
Normalised Curves v Temperature
10
T = 150C
-ISD Reverse Drain Current (A)
10
1
T = 25C
1
5V 10V
0.1
0.1
0.1
1
10
0.01 0.2
On-Resistance v Drain Current
-ID Drain Current (A)
-VSD Source-Drain Voltage (V)
0.4
0.6
0.8
1.0
1.2
1.4
Source-Drain Diode Forward Voltage
PROVISIONAL ISSUE C - JULY 2004 5
ZXMP3A13F
TYPICAL CHARACTERISTICS
300
10
C Capacitance (pF)
250 200 150 100 50 0 0.1 1
CISS COSS
-VGS Gate-Source Voltage (V)
VGS = 0V f = 1MHz
ID = -1.4A
8 6 4 2
VDS = -15V
CRSS
10
0 0
2
4
6
-VDS - Drain - Source Voltage (V)
Q - Charge (nC)
Capacitance v Drain-Source Voltage
Gate-Source Voltage v Gate Charge
PROVISIONAL ISSUE C - JULY 2004 6
ZXMP3A13F
PACKAGE OUTLINE PAD LAYOUT
PACKAGE DIMENSIONS
Millimeters DIM A B C D F G 0.37 0.085 Min 2.67 1.20 Max 3.05 1.40 1.10 0.53 0.15 0.015 0.0034 Inches Min 0.105 0.047 Max 0.120 0.055 0.043 0.021 0.0059 DIM H K L M N Millimeters Min 0.33 0.01 2.10 0.45 Max 0.51 0.10 2.50 0.64 Inches Max 0.013 0.0004 0.083 0.018 Max 0.020 0.004 0.0985 0.025
0.95 NOM
0.0375 NOM
1.90 NOM
0.075 NOM
(c) Zetex Semiconductors plc 2004
Europe Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex plc Lansdowne Road, Chadderton Oldham, OL9 9TY United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com
PROVISIONAL ISSUE C - JULY 2004 7


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